The COPRA Plasma Source ALD Assist solutions enable surface functionalization in the need of adequate low energy inputs.
The COPRA Plasma Source ALD Assist solutions can work with very low energy inputs paired with appropriate ion current density in order to achieve best homogeneity values. This is due the patented proprietary technological design which provides consistent ion current density properties.
With the COPRA Plasma Source ALD Assist solutions more film options are able as un-reactive to molecular co-reactants become available as the sources can handle any type of gas.
The COPRA Plasma Source ALD Assist solutions are available for substrate sizes ranging from 2 to 12 inches
ALD / Applications
Plasma Assisted ALD at lower temperature/power/energy processing.
Plasma Assisted ALD in the need of improved film properties due to more complete reaction with depositing film and precursor ligand removal.
Plasma Assisted ALD with more film options as precursors un-reactive to molecular co-reactants become available.
Plasma Assisted ALD with reduced purge and nucleation times, particularly at low temperatures where thermal co-reactants (i.e. H2O) require long purge times.