| COPRA LS9 The COPRA LS9 was first released in the year of 2004, especially developed for the encapsulation of OLEDs. Today it is a working horse for all kinds of plasma processing like PECVD, chemical etching and bias enhanced ion milling on flat substrates of a size up to 360mm times 360mm i.e. 14” square. This size fits to a batch of four 6” standard silicon wafer of the solar industry where it is widely used for the deposition of Antireflective “AR”- coatings. |
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| Substrate | 330mm x 300mm | ||
| Pressure Range | 5E-4 to 1mbar | ||
| Gases | any | ||
| RF-Power | max. 5000 Watt | ||
| RF Matching | Remote | ||
| Ion Energy | below 50 eV | ||
| Curent Density | up to 1mA/cm2 | ||
| Extraction | Grid less | ||
| Apps | PECVD | ||