COPRA DN400 and DN500 The COPRA DN400 and DN500 were originally designated for 200mm and 300mm wafer processing to form ultrathin Aluminum Oxides and Nitrides barrier. Today the DN400 and DN500 are additionally used for PECVD and Etching applications on all kind of flat substrates. Beside this face to face operation both type of source are also successfully established as PECVD assist sources in optical coating system with chamber diameters of up 1800mm |
| Substrate Size |
up to 8" for DN400 up to 12" for DN500 |
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Dimension | DN400 | DN500 |
| Pressure Range | 1E-4 to 1E-2mbar | A [mm[ | 430 | 569 | ||
| Gases | Any | B [mm] | 410 | 539 | ||
| RF-Power | max. 5000 Watt | C [mm] | 388 | 397 | ||
| Ion Energy | up to 250 eV | D [mm] | 20 | 22 | ||
| Current Density | up to 3 mA/ cm2 | E [mm] | 394 | 514 | ||
| Extraction | Grounded W-Grid | F [mm] | 12 | 21 | ||
| Apps | E-gun assist Wafer Processing |
Extration G [mm] |
266 |
398 |